SILMORE EPO-SIL 6824 FLIP-CHIP ENCAPSULANT EPOXY RESIN BLACK,30G-SYR
One Part/Fast curing at low temperature/Good flow and permeability
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Description
Application description：BGA,CSP flip-chip package coating epoxy resin
Additional information
| Brand | SIL-MORE |
|---|---|
| Manufacturer SKU | N/A |
| Application | Adhesive / Sealant |
| Market application | Consumer Products |
| Material | EPOXY |
| Mix Ratio by Weight | One Part |
| Color/Appearance | Black |
| Viscosity (mPa.s) | 3,040 |
| Tack-Free Time | N/A |
| Cure Condition | 15 mins@100℃, 30 mins@80℃ |
| Temperature Stability (℃) | -40℃~100℃ |
| Specific Gravity | 1.218 |
| Hardness (Shore) | 77 (D) |
| Tensile Strength (psi) | 58,000 |
| Dielectric Strength (KV/mm ) | 12 |
| Volume Resistivity (ohm*cm) | 4.5+E15 |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
