SIL-MORE Group is committed to promoting and developing high-performance green materials, helping the electronics industry achieve sustainability, reliability, and safety. Our technical team proudly introduces Dow’s eco-friendly conformal coating solutions — a solvent-free, low-VOC formulation that reduces environmental and occupational hazards, while offering multi-mode curing and UL94 V-0 flame retardant certification for both manufacturing flexibility […]
Category Archives: Events
The SIL-MORE R&D team proudly presents the “UV-SIL UV-Curable Adhesive Solution for Wearable Devices”! Specifically developed for smart wearable applications, this advanced solution has passed ISO 10993-23 skin irritation testing, ensuring skin-contact safety. It offers rapid curing and excellent adhesion, significantly enhancing manufacturing efficiency. A reliable and safe choice for the production of next-generation wearable […]
The SIL-MORE R&D team has developed the “UV-SIL High-Performance UV-Curable Adhesives” specifically for precision electronics and automotive modules. Whether for electronic component reinforcement, thread locking, lens module fixation, or protective bonding of precision ITO glass circuits, UV-SIL delivers high strength, low shrinkage, and fast curing for stable performance—enhancing production efficiency and ensuring reliable quality! [Product […]
Electrostatic Discharge (ESD) Plastics – A Key Material for Ensuring the Reliability of Precision Electronic Components In response to market trends, SIL-MORE Group introduces its “Key ESD Plastic Solutions”, featuring excellent electrostatic dissipative/conductive properties combined with flame-retardant performance. These materials are widely used in semiconductor wafer fabrication, IC testing, and electronic assembly equipment, effectively addressing […]
With the rise of electric vehicles, renewable energy, and diverse industrial power applications, the demand for higher performance and reliability in IGBT modules has grown significantly.SIL-MORE Group, leveraging over 30 years of expertise in electronic material applications, proudly recommends Dow’s Next-Generation IGBT Key Material Solutions. Covering encapsulation, structural bonding, and thermal management, these solutions help […]
In demanding thermal environments such as aerospace and semiconductor industries, the SIL-MORE Group technical team recommends the AOS Non-Silicone High-Temperature Thermal Interface Solutions. This series features a non-silicone formulation that minimizes outgassing risks while delivering excellent thermal conductivity and long-term thermal stability. It effectively prevents contamination of sensitive components and is ideal for applications requiring […]
Enhance Reliability in Extreme Environments As industrial sectors—especially electronics, power modules, and electric vehicles—demand adhesives that withstand severe temperatures and harsh conditions, Araldite® AW 4804 / HW 4804 rises to the challenge. This aluminumfilled, twocomponent epoxy offers a unique combination of thermal, mechanical, and chemical resistance, engineered for demanding applications. ■ Technical Highlights Outstanding heat resistance up to […]
Exclusively distributed by SIL-MORE Group Araldite® 2020, distributed by SIL-MORE Group, is a two-component epoxy adhesive featuring high transparency and low viscosity. Once cured, it offers a refractive index close to that of glass (n=1.553), making it ideal for transparent casting, lamination processes, and structural gap filling. It provides excellent adhesion to various substrates such […]
Sil-More Group recommends Everwide 7391 epoxy adhesive, a fast-curing two-component epoxy adhesive. It can quickly cure at room temperature, making it convenient to use and reducing processing time. The adhesive exhibits excellent adhesion after curing and provides resistance to grease, chemicals, and solvents. 【Product Features】 Provides excellent adhesion on plastic, ceramic, glass, and metal materials. […]
As electric vehicles advance toward greater intelligence and performance, thermal management remains the most critical challenge. SIL-MORE Group recommends the Dow Chemical next-generation thermally conductive potting solution. This product line features high thermal conductivity of 4.0 W/m·K and low volatility, specifically designed to protect and dissipate heat from EV power modules and electronic components. It […]