Category Archives: Events

High-Performance PCB Solder Mask Selection: Probimer® 88 92103 / 99003

In today’s rapidly evolving electronics industry, choosing the right solder mask ink is crucial for optimal PCB performance. SIL-MORE Group recommends Probimer® 88 92103 / 99003 for its stability and environmental benefits, making it a reliable choice for various high-performance applications. Product Features of Probimer® 88 92103 / 99003: Advantages of Probimer® 88 92103 / […]

SIL-MORE Group is dedicated to providing advanced semiconductor material solutions

SIL-MORE Group is dedicated to providing advanced semiconductor material solutions to meet the high-precision demands of today’s technology industry. Our extensive product range covers key materials for semiconductor manufacturing, ensuring excellence in quality and performance at every stage, from design to production. Whether enhancing chip performance or achieving higher process reliability, SIL-MORE delivers innovative and […]

High-Performance Flame-Retardant Recycled Plastics

As global environmental awareness continues to grow, the selection of sustainable materials has become a key direction for many companies’ future development. SIL-MORE Group recommends “High-Performance Flame-Retardant Recycled Plastics,” which not only contain up to 75% recycled content but also meet the demands for high safety and flame-retardant properties.  Product Features  Product Name :High-Performance Flame […]

Vivid Cure™ – Liquid Optically Clear Adhesive (LOCA)

SIL-MORE Group recommends the full range of Liquid Optically Clear Adhesives (LOCA) manufactured by Resin Designs. These products are single-component and cure without the need for mixing ratios or heat generation, providing consistent and reliable performance. UV-curable adhesives have become the industry standard for optical displays and device manufacturing, and LOCA adhesives are particularly suited […]

Dow Chemical liquid cooling solutions for servers

Facing high-power server cooling demands, SIL-MORE Group recommends the Dow Chemical liquid cooling solution for servers. This product series offers exceptional thermal conductivity, effectively lowering operating temperatures to prevent overheating shutdowns and hardware damage. Designed for data center liquid-cooled server equipment, it provides enduring and stable cooling performance, ensuring servers maintain reliable operation under heavy […]

EV Charging Station Thermoplastic Composite Solutions

Solve the challenges of EV charging station plastics with SIL-MORE’s “EV Charging Station Thermoplastic Composite Solutions.” We offer a one-stop plastic solution covering plugs, cables, charging guns, and housings to meet various thermoplastic composite needs. This accelerates product design and development, ensuring excellent performance and reliability. [Plastic Applications] Wall-mounted charging station housings Material: PC Weather […]

UV-SIL UV-Curing Electronic Adhesive Solution

Looking for electronic-grade UV-curing adhesive? We recommend the “UV-SIL UV-Curing Electronic Adhesive Solution,” developed by SIL-MORE’s R&D center. Choose the most suitable product based on your application scenario to address various challenges in electronic product manufacturing. 【Product Features】 UV-SIL 8039 Single component Material: Acrylic Viscosity: 75,000 (TI=5.6) mPa.s Hardness: Shore D78 Can adhere to common […]

Nano Top Low-Temperature Pressureless Sintering Silver Paste Solution

With the changing demands of the semiconductor market, chips are gradually becoming smaller and higher in power. SIL-MORE Group’s professional team has followed this trend and launched the “Nano Top Low-Temperature Pressureless Sintering Silver Paste Solution” for semiconductor packaging materials. The highlight of this solution is its powerful packaging-grade sintering technology, which not only overcomes […]

ARALDITE® 2011 Two-Component Epoxy Adhesive

SIL-MORE GROUP has been the agent for the ARALDITE® brand, which has a 70-year history of applications. This brand offers a wide range of bonding solutions. SIL-MORE GROUP recommends the ARALDITE® 2011 Two-Component Epoxy Adhesive. This product is a high-flow adhesive and a reliable encapsulation material. It has low viscosity and a long open time, […]