AI technology and high-performance computing are leading the way in shaping the future of technology. With the continuous evolution of high-performance chips and servers, low thermal conductivity materials are no longer sufficient to meet the demands. Additionally, in line with the trend towards environmental friendliness, materials that are easily repairable and reworkable to reduce waste have become a focal point for researchers. The professional team at SIL-MORE recommends the ” Reworkable High Thermal Gap Filler,” which not only meets high-power requirements but also reduces resource waste, making it the preferred choice for green products.
「Features」
DOWSIL™ TC-4083 Dispensable Thermal Pad
- Two Part，Room temperature cure or (at 80°C or higher) for fast cure
- Thermally conductive 10 W/mK
- Hardness Shore 00 58、Stress relieving and shock damping
- Dispensable，Replace thermal pad
- Application：5G telecom equipment and devices
DOWSIL™ TC-3065 Reworkable Thermal Gel
- One Part，Room temperature cure or (at 60°C or higher) for fast cure
- Thermally conductive 6.5 W/mK
- Hardness Shore 00 60、Stress relieving and shock damping
- Dispensable，Replace thermal pad
- Application：Optical module、GPU、SSD
Operation method
DOWSIL™ TC-4083 video
