Category Archives: News

As AI performance targets accelerate—demanding higher speed and power density—thermal management materials have become a critical enabler. Leveraging years of market experience, SIL-MORE Group recommends high-efficiency thermal interface solutions built on silicone matrices with highly loaded thermally conductive fillers, delivering high thermal conductivity, ultra-low oil bleed, and long-term stability. These materials support a wide range of BLT (bond line thickness) to maintain strong interfacial […]

With the growing diversification of electronic assembly and advanced packaging requirements, SIL-MORE Group introduces the SOMAR – IR Series Red Adhesives, providing customers with stable, reliable, and highly efficient process solutions. This series features non-slump characteristics and high adhesion strength, effectively meeting the needs of various process environments and component bonding applications. Product Lineup Model […]

With the rapid growth of AI, automotive sensors, and the Internet of Things (IoT), MEMS packaging faces critical challenges such as high power density, stringent thermal management, environmental sensitivity, and mechanical stress.  To address these demands, SIL-MORE’s technical team provides Dow’s semiconductor material solutions, leveraging silicone’s low-modulus stress relief and high-temperature resistance. These solutions deliver […]

As electronic components continue to miniaturize, the demand for chip durability in handheld devices is increasing. The SIL-MORE R&D team introduces the UV-SIL™ Reworkable Corner Bonding Solution, which  Solution, which utilizes UV curing to complete chip fixation within seconds. Compared to traditional thermal curing, this process saves 30–60 minutes of baking time while reducing thermal […]

With the rapid advancement of precision electronics, outdoor devices, and automotive modules, waterproofing and durability are no longer optional but essential. SIL-MORE Group recommends FR477-4 UV-curable resin as an innovative solution to replace traditional rubber gaskets, offering higher compression rebound and superior weather resistance to achieve lighter and more reliable sealing.  Item  Specification  Chemical Composition  […]

Bostik THERMELT™ 867 is a high-performance hot-melt adhesive specifically developed for Low Pressure Molding (LPM) applications. It offers excellent processing stability and high versatility, enabling efficient encapsulation while safeguarding delicate components.Its low-pressure molding characteristics make it particularly suitable for the encapsulation and protection of electronic and electrical parts, connectors, cables, and other precision components.  [Product […]