Category Archives: News

HighTemperature Structural Adhesive: Araldite® AW 4804 / HW 4804

Enhance Reliability in Extreme Environments   As industrial sectors—especially electronics, power modules, and electric vehicles—demand adhesives that withstand severe temperatures and harsh conditions, Araldite® AW 4804 / HW 4804 rises to the challenge. This aluminumfilled, twocomponent epoxy offers a unique combination of thermal, mechanical, and chemical resistance, engineered for demanding applications.  ■ Technical Highlights  Outstanding heat resistance up to […]

Araldite® 2020 – High Transparency Epoxy Adhesive

Exclusively distributed by SIL-MORE Group Araldite® 2020, distributed by SIL-MORE Group, is a two-component epoxy adhesive featuring high transparency and low viscosity. Once cured, it offers a refractive index close to that of glass (n=1.553), making it ideal for transparent casting, lamination processes, and structural gap filling. It provides excellent adhesion to various substrates such […]

Green Product High-performance Epoxy Resin Electronic Materials.

Sil-More Group recommends Everwide 7391 epoxy adhesive, a fast-curing two-component epoxy adhesive. It can quickly cure at room temperature, making it convenient to use and reducing processing time. The adhesive exhibits excellent adhesion after curing and provides resistance to grease, chemicals, and solvents. 【Product Features】 Provides excellent adhesion on plastic, ceramic, glass, and metal materials. […]

high-performance innovative flame-retardant recycled plastics

SIL-MORE Group is committed to providing professional electronic material solutions and continuously develops low-environmental-impact, high-performance innovative flame-retardant recycled plastics. Our expert team recommends PC plastics and PC/ABS alloys, a product series that meets the demands for PFAS-free, halogen-free, and high-recycled-content materials. Together with our customers, we are moving toward a low-carbon, non-toxic, and circular future.  […]

Low-Temperature Curing Conductive Paste Solution for FPCs.

As 5G smart mobile devices continue to become more compact and lightweight, flexible printed circuit boards (FPCs) are facing dual challenges of higher precision and increased flexibility. The professional team at SIL-MORE recommends the “Low-Temperature Curing Conductive Paste Solution for FPCs.” This solution features products from Nano Top and has been tested to withstand over […]

high-performance computing thermal solutions.

With the rapid development of high-performance computing (HPC) devices, SIL-MORE’s professional team provides high-performance computing thermal solutions. Our products offer higher thermal conductivity than traditional materials, aligning with the latest manufacturing processes and environmental sustainability. They are the preferred thermal materials for high-performance computing devices. 「Features 」 DOWSIL™ ICL-1XXX Single-Phase Immersion Cooling Fluid Material: Silicone […]

ARALDITE® 2035 A/B Epoxy Adhesive – High-Temperature Durability & Strong Bonding

SIL-MORE Group recommends ARALDITE® 2035 A/B, a two-component epoxy adhesive specifically designed for applications exposed to prolonged high-temperature environments. It provides excellent structural support and stability. ARALDITE® 2035 A/B cures at room temperature and can withstand extreme temperatures up to 204°C (400°F), ensuring exceptional bond strength and reliability under harsh conditions. It is ideal for […]

UV-SIL CIPG 477-V4 High Compression Resilience, Reworkable, Highly Stretchable Waterproof UV-Curable Resin

In modern industrial manufacturing, sealants are widely used for bonding and sealing electronic and electrical components. Gasket sealing plays a crucial role in protecting internal electronic components by preventing the ingress of dust, moisture, and corrosive substances, thus avoiding damage to precision components.  Gasket sealing technology is an essential part of industrial manufacturing. While traditional […]

Araldite® AV 170 Single-Component Epoxy Adhesive

Araldite® AV 170 is a single-component epoxy adhesive with excellent heat resistance and chemical resistance, making it a key product for structural bonding applications. It is especially suitable for bonding metals and high-temperature plastics.  Product Features  Thermal curing performance: Curing temperature range from 140°C to 180°C, achieving high strength quickly.  High peel strength: Ideal for […]

AOS Non-Silicone Thermal Conductive Solution

SIL-MORE Group is dedicated to providing advanced thermal management solutions tailored to meet the diverse needs of our clients.  Our professional team highly recommends the AOS Non-Silicone Thermal Conductive Solution, a product series renowned for its exceptional performance and long-term stability. It is specifically designed for applications where silicone-based thermal pads are unsuitable, and for […]