With the growing diversification of electronic assembly and advanced packaging requirements, SIL-MORE Group introduces the SOMAR – IR Series Red Adhesives, providing customers with stable, reliable, and highly efficient process solutions. This series features non-slump characteristics and high adhesion strength, effectively meeting the needs of various process environments and component bonding applications. Product Lineup Model […]
Category Archives: News
With the rapid growth of AI, automotive sensors, and the Internet of Things (IoT), MEMS packaging faces critical challenges such as high power density, stringent thermal management, environmental sensitivity, and mechanical stress. To address these demands, SIL-MORE’s technical team provides Dow’s semiconductor material solutions, leveraging silicone’s low-modulus stress relief and high-temperature resistance. These solutions deliver […]
As electronic components continue to miniaturize, the demand for chip durability in handheld devices is increasing. The SIL-MORE R&D team introduces the UV-SIL™ Reworkable Corner Bonding Solution, which Solution, which utilizes UV curing to complete chip fixation within seconds. Compared to traditional thermal curing, this process saves 30–60 minutes of baking time while reducing thermal […]
With the rapid development of AI computing, 5G, automotive electronics, and data centers, chip design is entering a new era of high power density and miniaturization, creating new challenges in thermal management and packaging. SIL-MORE’s professional team introduces the “NANOTOP Next-Generation Pressureless Sintering Silver Solution”, delivering exceptional thermal conductivity and ultra-low resistivity to meet the […]
With the rapid advancement of precision electronics, outdoor devices, and automotive modules, waterproofing and durability are no longer optional but essential. SIL-MORE Group recommends FR477-4 UV-curable resin as an innovative solution to replace traditional rubber gaskets, offering higher compression rebound and superior weather resistance to achieve lighter and more reliable sealing. Item Specification Chemical Composition […]
Bostik THERMELT™ 867 is a high-performance hot-melt adhesive specifically developed for Low Pressure Molding (LPM) applications. It offers excellent processing stability and high versatility, enabling efficient encapsulation while safeguarding delicate components.Its low-pressure molding characteristics make it particularly suitable for the encapsulation and protection of electronic and electrical parts, connectors, cables, and other precision components. [Product […]
SEMICON Taiwan 2025Exhibition Dates: September 10 (Wed) – September 12(Fri), 2025Venue: Taipei Nangang Exhibition Center, Hall 1, 1F (No. 1, Jingmao 2nd Rd., Nangang District, Taipei)Booth Number: #K2383 / 1F SEMICON Taiwan 2025 Floor Plan:Click here to view the floor pla Exclusive Benefits for Semiconductor / Microelectronics Industry ProfessionalsFrom now until August 31, professionals from […]
SIL-MORE Group is committed to promoting and developing high-performance green materials, helping the electronics industry achieve sustainability, reliability, and safety. Our technical team proudly introduces Dow’s eco-friendly conformal coating solutions — a solvent-free, low-VOC formulation that reduces environmental and occupational hazards, while offering multi-mode curing and UL94 V-0 flame retardant certification for both manufacturing flexibility […]
The SIL-MORE R&D team proudly presents the “UV-SIL UV-Curable Adhesive Solution for Wearable Devices”! Specifically developed for smart wearable applications, this advanced solution has passed ISO 10993-23 skin irritation testing, ensuring skin-contact safety. It offers rapid curing and excellent adhesion, significantly enhancing manufacturing efficiency. A reliable and safe choice for the production of next-generation wearable […]
The SIL-MORE R&D team has developed the “UV-SIL High-Performance UV-Curable Adhesives” specifically for precision electronics and automotive modules. Whether for electronic component reinforcement, thread locking, lens module fixation, or protective bonding of precision ITO glass circuits, UV-SIL delivers high strength, low shrinkage, and fast curing for stable performance—enhancing production efficiency and ensuring reliable quality! [Product […]