The SIL-MORE R&D team has developed the “UV-SIL High-Performance UV-Curable Adhesives” specifically for precision electronics and automotive modules. Whether for electronic component reinforcement, thread locking, lens module fixation, or protective bonding of precision ITO glass circuits, UV-SIL delivers high strength, low shrinkage, and fast curing for stable performance—enhancing production efficiency and ensuring reliable quality! [Product […]
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Electrostatic Discharge (ESD) Plastics – A Key Material for Ensuring the Reliability of Precision Electronic Components In response to market trends, SIL-MORE Group introduces its “Key ESD Plastic Solutions”, featuring excellent electrostatic dissipative/conductive properties combined with flame-retardant performance. These materials are widely used in semiconductor wafer fabrication, IC testing, and electronic assembly equipment, effectively addressing […]
With the rise of electric vehicles, renewable energy, and diverse industrial power applications, the demand for higher performance and reliability in IGBT modules has grown significantly.SIL-MORE Group, leveraging over 30 years of expertise in electronic material applications, proudly recommends Dow’s Next-Generation IGBT Key Material Solutions. Covering encapsulation, structural bonding, and thermal management, these solutions help […]
In demanding thermal environments such as aerospace and semiconductor industries, the SIL-MORE Group technical team recommends the AOS Non-Silicone High-Temperature Thermal Interface Solutions. This series features a non-silicone formulation that minimizes outgassing risks while delivering excellent thermal conductivity and long-term thermal stability. It effectively prevents contamination of sensitive components and is ideal for applications requiring […]
Enhance Reliability in Extreme Environments As industrial sectors—especially electronics, power modules, and electric vehicles—demand adhesives that withstand severe temperatures and harsh conditions, Araldite® AW 4804 / HW 4804 rises to the challenge. This aluminumfilled, twocomponent epoxy offers a unique combination of thermal, mechanical, and chemical resistance, engineered for demanding applications. ■ Technical Highlights Outstanding heat resistance up to […]
Exclusively distributed by SIL-MORE Group Araldite® 2020, distributed by SIL-MORE Group, is a two-component epoxy adhesive featuring high transparency and low viscosity. Once cured, it offers a refractive index close to that of glass (n=1.553), making it ideal for transparent casting, lamination processes, and structural gap filling. It provides excellent adhesion to various substrates such […]
Sil-More Group recommends Everwide 7391 epoxy adhesive, a fast-curing two-component epoxy adhesive. It can quickly cure at room temperature, making it convenient to use and reducing processing time. The adhesive exhibits excellent adhesion after curing and provides resistance to grease, chemicals, and solvents. 【Product Features】 Provides excellent adhesion on plastic, ceramic, glass, and metal materials. […]
SIL-MORE Group is committed to providing professional electronic material solutions and continuously develops low-environmental-impact, high-performance innovative flame-retardant recycled plastics. Our expert team recommends PC plastics and PC/ABS alloys, a product series that meets the demands for PFAS-free, halogen-free, and high-recycled-content materials. Together with our customers, we are moving toward a low-carbon, non-toxic, and circular future. […]
As 5G smart mobile devices continue to become more compact and lightweight, flexible printed circuit boards (FPCs) are facing dual challenges of higher precision and increased flexibility. The professional team at SIL-MORE recommends the “Low-Temperature Curing Conductive Paste Solution for FPCs.” This solution features products from Nano Top and has been tested to withstand over […]
With the rapid development of high-performance computing (HPC) devices, SIL-MORE’s professional team provides high-performance computing thermal solutions. Our products offer higher thermal conductivity than traditional materials, aligning with the latest manufacturing processes and environmental sustainability. They are the preferred thermal materials for high-performance computing devices. 「Features 」 DOWSIL™ ICL-1XXX Single-Phase Immersion Cooling Fluid Material: Silicone […]