As electric vehicles advance toward greater intelligence and performance, thermal management remains the most critical challenge. SIL-MORE Group recommends the Dow Chemical next-generation thermally conductive potting solution. This product line features high thermal conductivity of 4.0 W/m·K and low volatility, specifically designed to protect and dissipate heat from EV power modules and electronic components. It is UL 94 V-0 flame-rated and has passed rigorous thermal shock tests, ensuring long-lasting and stable thermal performance.
【Material Introduction】
- DOWSIL™ TC-6040 Two-Part Thermally Conductive Encapsulant
- Thermal Conductivity: 4.0 W/m·K
- Properties: High viscosity (33,000 mPa·s), cures at room temperature or accelerated at low heat
- Durability: Passed 85/85 test and thermal shock test (-40 to 150°C)
- Flame Rating: UL 94 V-0
- Operating Temperature Range: -45 to 175°C
- Applications: Suitable for ADAS, on-board chargers (OBC), DC/DC converters, inductors/transformers
DOWSIL™ TC-6032 Two-Part Thermally Conductive Encapsulant
- Thermal Conductivity: 3.2 W/m·K
- Properties: Low viscosity (6,500 mPa·s), cures at room temperature or accelerated at low heat
- Durability: Passed 85/85 test and thermal shock test (-40 to 150°C)
- Flame Rating: UL 94 V-0
- Operating Temperature Range: -45 to 175°C
- Siloxane Volatile Content (D4–D10): <100 ppm
- Applications: Suitable for ADAS, on-board chargers (OBC), DC/DC converters, inductors/transformers
DOWSIL™ TC-6032 VIDEO
https://videos.dow.com/view/M31286/