SIL-MORE’s professional thermal management solutions utilize DOWSIL™ TC-7006 Thermal Gel from Dow Chemical, which has passed dual 85 testing (85°C and 85% humidity) and thermal cycling validation (-40°C to 125°C). This single-component, non-curing thermal material is specifically designed for use in consumer electronics and telecom/data communication devices, making it ideal for applications such as notebook heat pipes or uneven gaps where thermal transfer is critical.
【 Material Recommendation 】
DOWSILTM TC-7006 Thermal Gum
- Thermal Conductivity: 7 W/m.K
- Thermal Resistance:28°C-cm²/W
- Reliability Certifications: Passes dual 85 and thermal cycling tests (-40°C to 125°C)
- Excellent Extrusion Rate and Anti-Sag Properties
- Easy Rework: No solvents required for removal
- Bond Line Thickness (BLT): 170 μm
- Applications: Ideal for laptop heat pipes and other thermal interface applications