SIL-MORE Group is committed to providing professional electronic material solutions and continuously develops low-environmental-impact, high-performance innovative flame-retardant recycled plastics. Our expert team recommends PC plastics and PC/ABS alloys, a product series that meets the demands for PFAS-free, halogen-free, and high-recycled-content materials. Together with our customers, we are moving toward a low-carbon, non-toxic, and circular future. […]
Category Archives: PRODUCT NEWS
The “UV-SIL UV Curing Electronic Adhesive Solution” The SIL-MORE Group’s R&D team has long been dedicated to developing green products, such as the UV–SIL UV-curable adhesive solutions. Two key products in this series include UV–SIL 8039, which meets GB VOC standards and holds UL GREENGUARD GOLD certification, and UV–SIL X-8039-BO, which contains over 60% bio-based […]
SIL-MORE Group recommends ARALDITE® 2035 A/B, a two-component epoxy adhesive specifically designed for applications exposed to prolonged high-temperature environments. It provides excellent structural support and stability. ARALDITE® 2035 A/B cures at room temperature and can withstand extreme temperatures up to 204°C (400°F), ensuring exceptional bond strength and reliability under harsh conditions. It is ideal for […]
In modern industrial manufacturing, sealants are widely used for bonding and sealing electronic and electrical components. Gasket sealing plays a crucial role in protecting internal electronic components by preventing the ingress of dust, moisture, and corrosive substances, thus avoiding damage to precision components. Gasket sealing technology is an essential part of industrial manufacturing. While traditional […]
Araldite® AV 170 is a single-component epoxy adhesive with excellent heat resistance and chemical resistance, making it a key product for structural bonding applications. It is especially suitable for bonding metals and high-temperature plastics. Product Features Thermal curing performance: Curing temperature range from 140°C to 180°C, achieving high strength quickly. High peel strength: Ideal for […]
SIL-MORE Group is dedicated to providing advanced thermal management solutions tailored to meet the diverse needs of our clients. Our professional team highly recommends the AOS Non-Silicone Thermal Conductive Solution, a product series renowned for its exceptional performance and long-term stability. It is specifically designed for applications where silicone-based thermal pads are unsuitable, and for […]
The “UV-SIL UV Curing Electronic Adhesive Solution” developed by Sil-More Group has obtained UL GREENGUARD GOLD and GB VOC international certifications. This series of products is specifically designed for the electronics manufacturing industry, offering advantages such as rapid curing within 30 seconds and weather resistance reliability between -40°C and 120°C. It effectively reduces the emission […]
Sil-More Group offers “Advanced Composite Plastic Solutions” to meet the growing demand for precision processing in high-tech electronic components. These solutions can be tailored to specific customer requirements by adjusting material properties and incorporating functionalities such as EMI shielding, flame resistance, and weather resistance. This ensures comprehensive compliance with the unique needs of high-tech electronics, […]
With the rise of AI data centers, the demand for high-power optical module cooling solutions has significantly increased. The professional team at Sil-More recommends the Dow Chemical Ultra-High-Power Optical Module Cooling Solution. This product features a high thermal conductivity of 12 W/m·K, is oil-free, and has ultra-low molecular volatility, ensuring long-term stable operation of optical […]
SIL-MORE’s professional thermal management solutions utilize DOWSIL™ TC-7006 Thermal Gel from Dow Chemical, which has passed dual 85 testing (85°C and 85% humidity) and thermal cycling validation (-40°C to 125°C). This single-component, non-curing thermal material is specifically designed for use in consumer electronics and telecom/data communication devices, making it ideal for applications such as notebook […]