With the rise of electric vehicles, renewable energy, and diverse industrial power applications, the demand for higher performance and reliability in IGBT modules has grown significantly.
SIL-MORE Group, leveraging over 30 years of expertise in electronic material applications, proudly recommends Dow’s Next-Generation IGBT Key Material Solutions. Covering encapsulation, structural bonding, and thermal management, these solutions help customers optimize product performance, improve manufacturing efficiency, and ensure long-term stable operation.
🔹 Encapsulation Protection – DOWSIL™ EG-4175
- Two-part gel with low viscosity (1,000 cP) for excellent flowability
- Accelerated curing at room or low temperatures
- Absorptive and soft cushioning properties, with heat resistance up to 180°C
- Ideal for IGBT module encapsulation, enhancing insulation and protective performance
🔹 Structural Bonding – DOWSIL™ EA-7158
- One-part adhesive with fast thermal cure (125°C / 30 min)
- Low viscosity (500 cP) for easy dispensing
- Solvent-free and environmentally friendly, with strong adhesion
- Suitable for multiple substrates, ensuring stable module structure
🔹 Thermal Management – DOWSIL™ TC-5860
- High thermal conductivity up to 6.0 W/m·K
- Non-curing type for improved processing efficiency
- Passed 1,000-hour thermal cycling test with excellent aging resistance
- High dielectric strength (>8 kV/mm) for enhanced electrical safety
- Ideal for IGBT thermal interface applications