With the rapid development of AI computing, 5G, automotive electronics, and data centers, chip design is entering a new era of high power density and miniaturization, creating new challenges in thermal management and packaging.
SIL-MORE’s professional team introduces the “NANOTOP Next-Generation Pressureless Sintering Silver Solution”, delivering exceptional thermal conductivity and ultra-low resistivity to meet the demanding requirements of next-generation high-power chips—making it the ideal choice for high-reliability packaging.
Key Highlights
- Pressureless sintering process: Eliminates the need for pressure, simplifying production and improving reliability
- Ultra-high thermal conductivity: Up to 260 W/m·K, effectively addressing extreme heat dissipation challenges
- Low volume resistivity: Less than 5×10⁻⁶ Ω·cm, ensuring superior electrical performance
- Thermal shock resistance: Passed -45°C to 150°C cycling tests, withstanding harsh temperature variations
Main Products
- NT-SA2700NS
Single-component / Pressureless sintering
Thermal conductivity: 260 W/m·K
Viscosity: 15,000 cPs
Volume resistivity: < 5×10⁻⁶ Ω·cm
- NT-SA2800NR
Single-component / Pressureless sintering
Thermal conductivity: 220–250 W/m·K
Viscosity: 12,000 cPs
Volume resistivity: < 5×10⁻⁶ Ω·cm
Application Fields
Suitable for high-power IGBT, RF power devices, power modules, and high-power chip bonding and packaging, meeting the market demands for high thermal performance, superior efficiency, and high reliability.