SIL-MORE Group recommends AOS non-silicone thermal interface solutions for automotive applications. These materials offer high thermal stability, low volatility, low oil bleed, and strong pump-out resistance, helping reduce interface displacement and contamination risks.
Designed to withstand vibration, thermal cycling, and high-temperature environments, they enable automotive electronic components to achieve more stable heat dissipation and longer service life even under demanding operating conditions.
Material Highlights
- Non-silicone formulationto prevent migration and contamination
• Resistant to vibration and thermal cycling displacement
• Long-term stability with low oil bleed and low volatility
• Balanced performance for automotive temperature ranges and thermal conductivity
【Recommended Models】
| Model | AOS 52050 | AOS 52153 | AOS 52022 |
| Application | Thin bond line interface (heatsink contact surface) | Gap filler
(for larger tolerances) |
Thin bond line interface (heatsink contact surface) |
| Performance | High thermal conductivity, low thermal resistance, thin-layer contact | Gap filling + thermal conduction, vibration-resistant and non-flowing | Lower thermal conductivity, low thermal resistance, thin-layer contact |
| Thermal Conductivity | 3.8 W/m·K @36°C | 3.5 W/m·K @36°C | 0.92 W/m·K @25°C |
| Thermal Resistance | 0.067 °C/W @50°C | 0.10 °C/W @50°C | 0.08 °C/W @50°C |
| Displacement Resistance | Pump-out resistant
No creep |
High viscosity
Vibration-resistant fixation |
|
| High-Temperature Bleed（200°C/24h） | Bleed 0.01%
Evap 0. 1% |
Bleed 0%
Evap 0% |
Bleed 0.1%
Evap 0.6% |
| Operating Temperature | -40°C ~ 200°C | -40°C ~ 200°C | -40°C ~ 200°C |