With the growing diversification of electronic assembly and advanced packaging requirements, SIL-MORE Group introduces the SOMAR – IR Series Red Adhesives, providing customers with stable, reliable, and highly efficient process solutions.
This series features non-slump characteristics and high adhesion strength, effectively meeting the needs of various process environments and component bonding applications.
Product Lineup
| Model | Curing Method | Features | Main Applications | Suitable Scenarios |
| IR-010 | Reflow curing (cured during reflow process) | Compatible with solder paste, supports double-sided reflow without affecting component self-alignment | SMT small chips, capacitors/resistors fixation | Double-sided SMT assembly, improving process efficiency and placement accuracy |
| IR-180HF | Low-temperature fast cure (100–120 ℃, 1 min) | Low-temperature cure, with non-slump stability; protects heat-sensitive components and shortens process time | Temperature-sensitive components (plastic packages, passive devices, communication modules, etc.) | Heat-sensitive components and high-reliability assembly processes, minimizing thermal damage risk |
Key Advantages
- Non-slump performance: Prevents component shift during reflow
- High adhesion strength: Suitable for various electronic materials
- Electrical & thermal resistance: Excellent insulation and reflow durability after curing
- One-part system: Easy handling with stable shelf life
- Flexible solutions: Choose between IR-010 (reflow cure) and IR-180HF (low-temperature fast cure) to fit different production line needs