With the rapid growth of AI, automotive sensors, and the Internet of Things (IoT), MEMS packaging faces critical challenges such as high power density, stringent thermal management, environmental sensitivity, and mechanical stress.
To address these demands, SIL-MORE’s technical team provides Dow’s semiconductor material solutions, leveraging silicone’s low-modulus stress relief and high-temperature resistance. These solutions deliver reliable and efficient performance for MEMS packaging, enabling higher performance, longer lifespan, and greater stability—fully supporting next-generation applications that require both precision and high reliability.
Product Highlights
DOWSIL™ TC-5960 Thermal Compound
- One-part, solvent-free formulation
- Thermal conductivity: 6.0 W/m·K
- Thermal resistance: 0.03 °C·cm²/W
- Suitable for bare-die thermal management (TIM 1.5) applications
DOWSIL™ ME-1800 Thermally & Electrically Conductive Adhesive
- One-part, heat-curable type
- Thermal conductivity: 6.8 W/m·K
- Thermal resistance: 0.12 °C·cm²/W
- Electrical resistivity: 1.8E-04 Ω·cm
- Withstands lead-free solder reflow temperature (260 °C)
- Suitable for MEMS chip bonding applications
DOWSIL™ ME-4039 Chip Protection Adhesive
- Two-part, heat-curable type
- Excellent electrical insulation
- Effectively relieves stress impact
- Hardness adjustable via mixing ratio
- No by-products after curing
- Suitable for wire and chip protection coatings
- Low ionic content