With the changing demands of the semiconductor market, chips are gradually becoming smaller and higher in power.
SIL-MORE Group’s professional team has followed this trend and launched the “Nano Top Low-Temperature Pressureless Sintering Silver Paste Solution” for semiconductor packaging materials. The highlight of this solution is its powerful packaging-grade sintering technology, which not only overcomes porosity issues but also enhances thermal conductivity and offers excellent electrical conductivity. It is the best packaging material solution for next-generation high-power chips.
【Product Highlights】
NT-SA2700NR-2C
- One part, Pressureless sintering
- Thermal conductivity 260 W/m.K
- Viscosity 15,000 cPs
- Volume Resistivity ＜5×10-6Ω·cm
NT-SA2800NR
- One part, Pressureless sintering
- Thermal conductivity 220~250 W/m.K
- Viscosity 12,000 cPs
- Volume Resistivity ＜5×10-6Ω·cm
- Sintering Temperature as Low as 170℃
NT-SA2700NR
- One part, Pressureless sintering
- Thermal conductivity 160 W/m.K
- Viscosity 9,000 cPs
- Volume Resistivity ＜5×10-6Ω·cm
Porosity Comparison
