As the power of electronic products increases, composite circuit boards are developing towards integrating functions and reducing size, which also leads to the problem of excessive heat concentration. SIL-MORE Group recommends Dow Chemical’s next-generation high-power thermal products. This series not only advances thermal performance but also significantly enhances reliability. Here are three representative Dow Chemical thermal products and their applications:
【Material Recommendations】
DOWSILTM TC-7006 Thermal Gum
- One part、No curing process required
- Thermal Conductivity: 7 W/m.K
- Passed 85℃/ 85%RH、thermal cycling reliability tests
- Low VOCs
- Suitable for notebook heat pipe components
DOWSILTM TC–6040 Thermal Conductive Encapsulant
- Two part、Heat cure
- Thermal Conductivity: 4 W/m.K
- Suitable for use to -45~150°C
- UL 94 V-0
- Suitable for electric motorcycle motor drivers and automotive inductors
DOWSILTM TC–6032 Thermal Conductive Encapsulant
- Two part、Heat cure
- Thermal Conductivity: 3.2 W/m.K
- Suitable for long term use at +150°C
- UL 94 V-0
- Suitable for AI server power modules