Dow Chemical liquid cooling solutions for servers

Facing high-power server cooling demands, SIL-MORE Group recommends the Dow Chemical liquid cooling solution for servers. This product series offers exceptional thermal conductivity, effectively lowering operating temperatures to prevent overheating shutdowns and hardware damage. Designed for data center liquid-cooled server equipment, it provides enduring and stable cooling performance, ensuring servers maintain reliable operation under heavy loads.

【Material recommendation】

DOWSILTM ICL-1XXX Series Material: Silicone oil Thermal conductivity: 0.18~ W/m.K Specific heat: 2.25~ J/g.K Dielectric constant: ~2.276 Volume resistivity: ~1×10^15 ohm-cm Non-reactivity with server internal materials Very low Global Warming Potential (GWP) and zero Ozone Depletion Potential (ODP) Suitable for single-phase immersion cooling systems

DOWFROST™ Heat Transfer Fluid Material: Food-grade propylene glycol and food-grade corrosion inhibitors Thermal conductivity: 0.3~ W/m.K Specific heat: 3.3~ J/g.K Provides antifreeze protection below -50°C and burst protection below -73°C Can be blended with water as needed, such as PG25%, PG30%, PG40% Compatible with cooling system materials Made from FDA and NSF food-grade ingredients Suitable for cold plate cooling systems