SIL-MORE Group is dedicated to providing advanced thermal management solutions tailored to meet the diverse needs of our clients.
Our professional team highly recommends the AOS Non-Silicone Thermal Conductive Solution, a product series renowned for its exceptional performance and long-term stability. It is specifically designed for applications where silicone-based thermal pads are unsuitable, and for industries that demand high reliability, safety, and precision in thermal conductivity.
[Material Characteristics]
AOS 52153 Gap Filler
- Thermal Conductivity: 3.5 W/m·K
- Thermal Resistance: 0.1 @ 50°C/W
- Non-bleeding and resistant to vibration-induced sagging
- Operating Temperature: -40°C to 200°C
- Applications: Heat dissipation for optical transceivers (BOSA), automotive lighting PCBA, and more.
AOS 52027 Heat Sink Compound
- Thermal Conductivity: 0.75 W/m·K
- Thermal Resistance: 0.17 @ 50°C/W
- Operating Temperature: 10°C to 250°C
- Non-bleeding with low volatile gas properties
- Applications: Suitable for semiconductor high-temperature sensing equipment and thermal warpage deformation detectors.