high-performance computing thermal solutions.

With the rapid development of high-performance computing (HPC) devices, SIL-MORE’s professional team provides high-performance computing thermal solutions. Our products offer higher thermal conductivity than traditional materials, aligning with the latest manufacturing processes and environmental sustainability. They are the preferred thermal materials for high-performance computing devices.

「Features

DOWSIL™ ICL-1XXX Single-Phase Immersion Cooling Fluid

  • Material: Silicone oil
  • Thermal conductivity: 0.18~ W/m·K
  • Specific heat capacity: 2.25~ J/g·K
  • Extremely low Global Warming Potential (GWP) and zero Ozone Depletion Potential (ODP)
  • Applications: Suitable for single-phase immersion cooling systems in AI servers and supercomputers

DOWFROST™ Cold Plate Cooling Fluid

  • Material: Composed of food-grade propylene glycol and food-grade corrosion inhibitors
  • Thermal conductivity: 0.3~ W/m·K
  • Specific heat capacity: 3.3~ J/g·K
  • Manufactured with FDA- and NSF-compliant food-grade ingredients
  • Applications: Suitable for cold plate cooling systems in AI servers and supercomputers

DOWSIL™ TC-3080 Ultra-Soft Thermal Gel

  • Single-component with a long working time of up to 30 days at room temperature (Cure time: 30 min @ 80°C with heating)
  • Thermal conductivity: 7 W/m·K
  • BLT of 40μm, suitable for ultra-thin devices
  • Applications: Ultra-thin electronic products, power chips, and 5G communication equipment

DOWSIL™ TC-7006 Thermal Putty

  • Single-component, no curing process required
  • Thermal conductivity: 7 W/m·K
  • Vertical support up to 1.5mm thickness
  • Low volatile organic compounds (VOCs) and reworkable
  • Applications: Suitable for NB heat pipe components and electronic components