As 5G smart mobile devices continue to become more compact and lightweight, flexible printed circuit boards (FPCs) are facing dual challenges of higher precision and increased flexibility.
The professional team at SIL-MORE recommends the “Low-Temperature Curing Conductive Paste Solution for FPCs.” This solution features products from Nano Top and has been tested to withstand over 2,000 bending cycles. It offers low resistance and supports high-resolution circuit designs under 50μm, effectively replacing traditional silver plating and copper foil processes. It is an ideal material choice for achieving thinner and lighter FPC designs.
【 Material Features 】
NT-ST80B
- Viscosity: 3,000 ± 500 cP
- Resistivity: ≤ 14 mΩ/sq/mil
- Curing: 30 minutes @ 130°C
- Highlight: Stackable printing; non-corrosive to underlying ink layers
NT-ST80C
- Viscosity: 9,000 ± 2,000 cP
- Resistivity: ≤ 16 mΩ/sq/mil
- Curing: 30 minutes @ 130°C
- Highlight: Resistivity increase ≤ 2% after reliability testing
NT-ST80S
- Viscosity: 2,100 ± 300 cP
- Resistivity: ≤ 15 mΩ/sq/mil
- Curing: 40 minutes @ 130°C
- Highlight: Recovers to original form after 30% elongation
NT-ST80A
- Viscosity: 14,000 ± 2,000 cP
- Resistivity: ≤ 14 mΩ/sq/mil
- Curing: 60 minutes @ 130°C
- Highlight: Applicable to PET, TPU, graphene, and other film materials