Bostik THERMELT™ 867 is a high-performance hot-melt adhesive specifically developed for Low Pressure Molding (LPM) applications. It offers excellent processing stability and high versatility, enabling efficient encapsulation while safeguarding delicate components.
Its low-pressure molding characteristics make it particularly suitable for the encapsulation and protection of electronic and electrical parts, connectors, cables, and other precision components.
[Product Features]
✅ Low-pressure processing that prevents component damage
✅ Excellent adhesion to a wide range of substrates (plastics, metals, PCB, etc.)
✅ UL94 V-0 flame-retardant certified (UL File E116659)
✅ Good flowability and stable processing performance
✅ THERMELT® formulations are made from up to 90% bio-based
[Product Trial & Sample Requests]
For more information, please contact Product Manager Jason during business hours at +886-2-85122222#594 Our professional team is ready to assist you.