SIL-MORE Group recommends the Bostik THERMELT Series, formulated with copolyamide hot-melt resins and specifically designed for Low Pressure Molding (LPM) technology. This series combines mechanical strength, thermal stability, and electrical insulation, while offering a solvent-free, non-reactive clean process that meets the industry’s dual requirements for both efficiency and sustainability.
| Product | Key Properties | Application Highlights |
| 867HV | Low dielectric, RoHS compliant | Electrical insulation, thermal shock protection |
| 195 | High hardness, excellent thermal stability | High-strength molding, heat resistance |
| 865 | Excellent low-temperature toughness, low modulus | Cold environment use, crack-free encapsulation |
Core Features
- Versatile Performance: Covers low dielectric, high heat resistance, and low-temperature toughness
- High Reliability: Provides structural protection, thermal management, and insulation safety
- Eco-Friendly: Solvent-free, non-reactive, and RoHS compliant
Application Areas
- Automotive electronics, PCB, and connectors
- Wire harnesses, cables, LED modules, and power devices
- Durable encapsulation for consumer electronics