As electronic components continue to miniaturize, the demand for chip durability in handheld devices is increasing. The SIL-MORE R&D team introduces the UV-SIL™ Reworkable Corner Bonding Solution, which Solution, which utilizes UV curing to complete chip fixation within seconds. Compared to traditional thermal curing, this process saves 30–60 minutes of baking time while reducing thermal stress and solder joint defects. The solution effectively disperses stress and strengthens the bond between the chip and substrate, significantly enhancing reliability and durability. With its reworkable feature—removable by heat—it enables convenient repair, lowers scrap rates, and supports sustainability. This advanced adhesive solution meets the stringent requirements of miniaturized, high-precision packaging in next-generation electronics.
【Product Features | UV-SIL™ 6690】
- Hardness Shore D60: Balances rigidity and toughness, effectively reinforcing chip edges
- Viscosity 38,000 mPa·s, Non-slumping: Stable operation, ideal for precise dispensing
- Elongation at Break 280%: Excellent flexibility to absorb shock and stress
- Reworkable: Easily removed with a hot air gun at 150℃, leaving no residue
Application photos and process introduction available upon request.
