As AI high-performance computing and cloud services continue to grow, data centers are seeing a sharp rise in demand for high-speed transmission and bandwidth. High-speed optical modules have become a critical interconnect between servers and switches. Leveraging a broad portfolio of electronic materials and extensive application experience, SIL-MORE Group provides a one-stop material solution for key areas of high-speed optical modules—including thermal management, bonding, and EMI shielding—helping customers improve reliability and manufacturing yield.
[Solution Highlights]
Key adhesive/material applications for high-speed optical modules:
Thermal Gel: Fills gaps between chips and heat-dissipation structures to reduce thermal resistance and stabilize the temperature of critical components.
Insulating Adhesive: Secures PCBs, optical parts, and mechanical components while providing electrical insulation to reduce short-circuit risk.
Active Alignment Adhesive: UV + thermal cure with low shrinkage to maintain precise alignment between optical fibers and optoelectronic components over time.
EMI Shielding Adhesive: Forms a shielding layer around high-speed signal areas to reduce crosstalk and external interference.
Conductive Die Attach: Provides chip fixation along with thermal and electrical conductivity to optimize overall device performance.
SIL-MORE Advantages:
Complete material portfolio in one place—reducing integration cost across multiple suppliers
Balanced RF performance, thermal stability, and environmental resistance, ready for 800G and beyond
Mass-production and automation-friendly—improving assembly efficiency and yield
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