As AI performance targets accelerate—demanding higher speed and power density—thermal management materials have become a critical enabler. Leveraging years of market experience, SIL-MORE Group recommends high-efficiency thermal interface solutions built on silicone matrices with highly loaded thermally conductive fillers, delivering high thermal conductivity, ultra-low oil bleed, and long-term stability. These materials support a wide range of BLT (bond line thickness) to maintain strong interfacial conformity and efficiently transfer heat into the cooling structure. They also improve mass-production consistency and reworkability for maintenance, enhancing long-term reliability and helping systems withstand harsh environmental variations.
Thermal Material Highlights
- Single-component, no curing process required
- Compatible with dispensing and automated application
- Ultra-low oil separation, reworkable / repair-friendly
- Helps reduce thermal resistance and improve reliability
Recommended Products
- DOWSIL™ TC-7006 Thermal Putty
- Thermal conductivity: 7.5 W/m·K
- Excellent vertical stability, supports thickness up to 1.5 mm
Reliability verified through 85°C/85%RH testing and 1,000 hours of thermal cycling validation
DOWSIL™ TC-7004 Thermal Putty
- Thermal conductivity: 4.3 W/m·K
- High thixotropy for strong shape retention and minimal slump
- Enables thinner BLT to further lower interfacial thermal resistance
Target Applications
Suitable for high power-density heat sources such as AI computing laptops and networking / communication equipment.
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