Category Archives: News

UV-SIL UV-Curing Electronic Adhesive Solutions – Enhancing Manufacturing Efficiency and Environmental Performance 

The “UV-SIL UV Curing Electronic Adhesive Solution” developed by Sil-More Group has obtained UL GREENGUARD GOLD and GB VOC international certifications. This series of products is specifically designed for the electronics manufacturing industry, offering advantages such as rapid curing within 30 seconds and weather resistance reliability between -40°C and 120°C. It effectively reduces the emission […]

Araldite® 2033:Advanced Flame-Retardant Structural Adhesive for Electronics and Railways

With the growing demand for enhanced electronic safety and high-performance structural adhesives, Huntsman introduces Araldite® 2033, a room temperature-curing structural adhesive featuring exceptional flame-retardant properties. Certified to meet UL 94 V-0 flame-retardant standards and EN 45545-2:2013 fire safety requirements, it complies with R22 and R23 criteria for HL3 level—the highest standard set by the European […]

Innovative  Breakthrough! UV-SIL UV-Curable Electronic Adhesive Achieves UL GREENGUARD Gold Certification

The SIL-MORE team has developed the “UV-SIL UV-Curable Electronic Adhesive” series, which has earned the UL GREENGUARD Gold Certification. This product series cures rapidly within 30 seconds under UV light, is free of organotin, and features ultra-low TVOC content, making it suitable for bonding and securing a wide range of substrates. The UV-SIL series not […]

SIL-MORE’s professional thermal management solutions

SIL-MORE’s professional thermal management solutions utilize DOWSIL™ TC-7006 Thermal Gel from Dow Chemical, which has passed dual 85 testing (85°C and 85% humidity) and thermal cycling validation (-40°C to 125°C). This single-component, non-curing thermal material is specifically designed for use in consumer electronics and telecom/data communication devices, making it ideal for applications such as notebook […]

Araldite®2014-2: Specialized Adhesive for Coolant Applications

Sil-More Group, as an official agent for the Araldite® brand, is pleased to recommend Araldite® 2014-2, a high-performance adhesive specifically designed for coolant applications. This adhesive offers precise positioning and is ideal for multi-layer structural bonding. With a thickness capacity of up to 5mm without sagging, Araldite®provides a safe and efficient bonding solution even under high […]

High-Performance PCB Solder Mask Selection: Probimer® 88 92103 / 99003

In today’s rapidly evolving electronics industry, choosing the right solder mask ink is crucial for optimal PCB performance. SIL-MORE Group recommends Probimer® 88 92103 / 99003 for its stability and environmental benefits, making it a reliable choice for various high-performance applications. Product Features of Probimer® 88 92103 / 99003: Advantages of Probimer® 88 92103 / […]

SIL-MORE Group is dedicated to providing advanced semiconductor material solutions

SIL-MORE Group is dedicated to providing advanced semiconductor material solutions to meet the high-precision demands of today’s technology industry. Our extensive product range covers key materials for semiconductor manufacturing, ensuring excellence in quality and performance at every stage, from design to production. Whether enhancing chip performance or achieving higher process reliability, SIL-MORE delivers innovative and […]

Vivid Cure™ – Liquid Optically Clear Adhesive (LOCA)

SIL-MORE Group recommends the full range of Liquid Optically Clear Adhesives (LOCA) manufactured by Resin Designs. These products are single-component and cure without the need for mixing ratios or heat generation, providing consistent and reliable performance. UV-curable adhesives have become the industry standard for optical displays and device manufacturing, and LOCA adhesives are particularly suited […]

Nano Top Low-Temperature Pressureless Sintering Silver Paste Solution

With the changing demands of the semiconductor market, chips are gradually becoming smaller and higher in power. SIL-MORE Group’s professional team has followed this trend and launched the “Nano Top Low-Temperature Pressureless Sintering Silver Paste Solution” for semiconductor packaging materials. The highlight of this solution is its powerful packaging-grade sintering technology, which not only overcomes […]