As electronic products become thinner, smaller, and increasingly equipped with smart sensing capabilities, SIL-MORE Group has drawn on its extensive experience in electronic materials applications to develop the UV-SIL UV-curable adhesive series. Developed with the performance of international brands as a benchmark, the series combines product reliability with competitive cost efficiency and local technical support. […]
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SIL-MORE Group provides ARALDITE® two-component epoxy adhesive solutions with long working time, fast curing, and high-reliability structural bonding performance. These solutions are suitable for electronic encapsulation, multi-material assembly, and demanding applications, helping improve process efficiency and product reliability. ARALDITE® 2011 Long Working Time · Precision Bonding Product Benefits Excellent flow and self-leveling Long working time […]
As electronic devices become thinner, adopt curved designs, and integrate smart sensing, conductive circuits must deliver stable electrical performance while remaining flexible, conformable, and resistant to repeated deformation. SIL-MORE Group introduces NANOTOP flexible conductive silver ink, combining excellent conductivity, flexibility, printability, and environmental resistance. Suitable for medical sensing patches, robotic electronic skin, and curved touch […]
SIL-MORE Group Partners with MKE to Introduce Solder Paste for Laser-Assisted Bonding SIL-MORE Group has partnered with South Korea-based MKE LAB to introduce solder paste specifically developed for Laser-Assisted Bonding (LAB). Engineered for rapid, localized laser heating, the solder paste supports fast temperature ramp-up and short bonding cycles, making it ideal for Flip Chip and […]
As HPC, AI, and advanced packaging technologies continue to evolve, thermal management and packaging reliability have become increasingly critical. Leveraging years of experience in electronic materials and technical support, SIL-MORE Group provides comprehensive DOWSIL™ semiconductor material solutions for die and wire protection, die attach, high-performance thermal interface materials (TIM), and large-area packaging applications. DOWSIL™ materials […]
To meet the thermal management needs of high-power power supplies and communication modules, SIL-MORE Group combines material analysis with process application expertise to provide the DOWSIL™ TC-7120 Thermal Gum thermal solution. By evaluating module structure, gap-filling thickness, application conditions, and heat dissipation paths, we help customers optimize material selection and configuration. TC-7120 offers high thermal conductivity, easy application, excellent gap-filling performance, […]
SIL-MORE Group integrates material selection, application validation, and processing expertise to provide PP material solutions for electronic and automotive components. We help customers optimize product performance and accelerate development and mass production. Applications Electronics: Housings, structural components, and injection-molded parts Automotive: Interior components, functional parts, and various plastic components Material Features High-Flow Molding Suitable for thin-wall, complex, and large […]
Sil-More Group sincerely invites you to join us at the 2026 OCP Regional Summit, where we will explore next-generation coolant management technologies for data centers. At this event, in collaboration with NALCO, we will showcase our comprehensive data center liquid cooling solutions: Real-time Coolant Monitoring System Advanced Coolant Material Solutions Exhibition Information Event: 2026 OCP […]
As electronic components continue to become smaller, printing processes require increasingly precise cleaning performance. SIL-MORE’s professional team recommends an environmentally friendly SMT stencil cleaning solution that effectively removes fine-pitch solder paste, flux, and process residues. It helps maintain stencil cleanliness and consistent printing quality while reducing the risk of printing defects. Featuring a low-VOC formulation, the solution […]
To meet the growing demand for precision components and customized parts in humanoid robotics, SIL-MORE recommends the SLS Powder Solution for 3D Printing, featuring materials such as PA12 and TPU for complex geometries, lightweight designs, and low-volume, high-mix manufacturing. 【Material Highlights】 PA12 Nylon 12 Powder PA12 offers excellent impact resistance, mechanical strength, and dimensional stability. […]