As AI high-performance computing and cloud services continue to grow, data centers are seeing a sharp rise in demand for high-speed transmission and bandwidth. High-speed optical modules have become a critical interconnect between servers and switches. Leveraging a broad portfolio of electronic materials and extensive application experience, SIL-MORE Group provides a one-stop material solution for […]
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To meet global supply-chain decarbonization demands and the growing trend of green products, SIL-MORE Group introduces the UV-SIL™ UV-Curing Green Integrated Solutions—covering high bio-based content, low VOC/low outgassing, skin-contact safety for wearables, and reworkable edge reinforcement.With a clear “Key Features × Applications” mapping, we help you select the right material faster—reducing validation risk, accelerating adoption, and supporting both mass-production efficiency and sustainability goals. Low VOC / […]
人形機器人正進入爆發式成長階段，並有望成為人類最親密的夥伴。 這些機器人依靠高性能塑膠來實現輕量化設計、耐用性和設計自由度。 SIL-MORE 集團提供一站式材料解決方案——從 PC/ABS 外殼和 PA12 精密組件到 TPU 仿生結構和 PEEK/PPS 框架和接頭——幫助客戶在機器人時代推動創新。 主要塑膠應用及性能 PEEK：替代金屬結構的首選輕質材料 PPS：中等強度、輕質且性價比高 PA12：非常適合小批量複雜結構和無模具3D列印 PC/ABS：適用於色彩範圍廣、抗衝擊性高的外飾件 TPU、TPE：觸感柔軟且仿生的結構 影片連結：https://youtu.be/0KRIr3rHR2E
With the growing diversification of electronic assembly and advanced packaging requirements, SIL-MORE Group introduces the SOMAR – IR Series Red Adhesives, providing customers with stable, reliable, and highly efficient process solutions. This series features non-slump characteristics and high adhesion strength, effectively meeting the needs of various process environments and component bonding applications. Product Lineup Model […]
With the rapid growth of AI, automotive sensors, and the Internet of Things (IoT), MEMS packaging faces critical challenges such as high power density, stringent thermal management, environmental sensitivity, and mechanical stress. To address these demands, SIL-MORE’s technical team provides Dow’s semiconductor material solutions, leveraging silicone’s low-modulus stress relief and high-temperature resistance. These solutions deliver […]
As electronic components continue to miniaturize, the demand for chip durability in handheld devices is increasing. The SIL-MORE R&D team introduces the UV-SIL™ Reworkable Corner Bonding Solution, which Solution, which utilizes UV curing to complete chip fixation within seconds. Compared to traditional thermal curing, this process saves 30–60 minutes of baking time while reducing thermal […]
SIL-MORE Group recommends the Bostik THERMELT Series, formulated with copolyamide hot-melt resins and specifically designed for Low Pressure Molding (LPM) technology. This series combines mechanical strength, thermal stability, and electrical insulation, while offering a solvent-free, non-reactive clean process that meets the industry’s dual requirements for both efficiency and sustainability. Product Key Properties Application Highlights 867HV […]
📍 Sep. 10–12｜Nangang Exhibition Center Hall 1｜Booth K2383✨ Highlights: Advanced Packaging Materials × Green Process Solutions🌳 We sincerely invite you to visit and explore material innovations with us!
With the rapid development of AI computing, 5G, automotive electronics, and data centers, chip design is entering a new era of high power density and miniaturization, creating new challenges in thermal management and packaging. SIL-MORE’s professional team introduces the “NANOTOP Next-Generation Pressureless Sintering Silver Solution”, delivering exceptional thermal conductivity and ultra-low resistivity to meet the […]
With the rapid advancement of precision electronics, outdoor devices, and automotive modules, waterproofing and durability are no longer optional but essential. SIL-MORE Group recommends FR477-4 UV-curable resin as an innovative solution to replace traditional rubber gaskets, offering higher compression rebound and superior weather resistance to achieve lighter and more reliable sealing. Item Specification Chemical Composition […]