SIL-MORE Group recommends ARALDITE® 2035 A/B, a two-component epoxy adhesive specifically designed for applications exposed to prolonged high-temperature environments. It provides excellent structural support and stability. ARALDITE® 2035 A/B cures at room temperature and can withstand extreme temperatures up to 204°C (400°F), ensuring exceptional bond strength and reliability under harsh conditions. It is ideal for […]
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In modern industrial manufacturing, sealants are widely used for bonding and sealing electronic and electrical components. Gasket sealing plays a crucial role in protecting internal electronic components by preventing the ingress of dust, moisture, and corrosive substances, thus avoiding damage to precision components. Gasket sealing technology is an essential part of industrial manufacturing. While traditional […]
Araldite® AV 170 is a single-component epoxy adhesive with excellent heat resistance and chemical resistance, making it a key product for structural bonding applications. It is especially suitable for bonding metals and high-temperature plastics. Product Features Thermal curing performance: Curing temperature range from 140°C to 180°C, achieving high strength quickly. High peel strength: Ideal for […]
SIL-MORE Group is dedicated to providing advanced thermal management solutions tailored to meet the diverse needs of our clients. Our professional team highly recommends the AOS Non-Silicone Thermal Conductive Solution, a product series renowned for its exceptional performance and long-term stability. It is specifically designed for applications where silicone-based thermal pads are unsuitable, and for […]
The “UV-SIL UV Curing Electronic Adhesive Solution” developed by Sil-More Group has obtained UL GREENGUARD GOLD and GB VOC international certifications. This series of products is specifically designed for the electronics manufacturing industry, offering advantages such as rapid curing within 30 seconds and weather resistance reliability between -40°C and 120°C. It effectively reduces the emission […]
Sil-More Group offers “Advanced Composite Plastic Solutions” to meet the growing demand for precision processing in high-tech electronic components. These solutions can be tailored to specific customer requirements by adjusting material properties and incorporating functionalities such as EMI shielding, flame resistance, and weather resistance. This ensures comprehensive compliance with the unique needs of high-tech electronics, […]
With the growing demand for enhanced electronic safety and high-performance structural adhesives, Huntsman introduces Araldite® 2033, a room temperature-curing structural adhesive featuring exceptional flame-retardant properties. Certified to meet UL 94 V-0 flame-retardant standards and EN 45545-2:2013 fire safety requirements, it complies with R22 and R23 criteria for HL3 level—the highest standard set by the European […]
With the rise of AI data centers, the demand for high-power optical module cooling solutions has significantly increased. The professional team at Sil-More recommends the Dow Chemical Ultra-High-Power Optical Module Cooling Solution. This product features a high thermal conductivity of 12 W/m·K, is oil-free, and has ultra-low molecular volatility, ensuring long-term stable operation of optical […]
The SIL-MORE team has developed the “UV-SIL UV-Curable Electronic Adhesive” series, which has earned the UL GREENGUARD Gold Certification. This product series cures rapidly within 30 seconds under UV light, is free of organotin, and features ultra-low TVOC content, making it suitable for bonding and securing a wide range of substrates. The UV-SIL series not […]
SIL-MORE’s professional thermal management solutions utilize DOWSIL™ TC-7006 Thermal Gel from Dow Chemical, which has passed dual 85 testing (85°C and 85% humidity) and thermal cycling validation (-40°C to 125°C). This single-component, non-curing thermal material is specifically designed for use in consumer electronics and telecom/data communication devices, making it ideal for applications such as notebook […]