The “UV-SIL UV Curing Electronic Adhesive Solution” The SIL-MORE Group’s R&D team has long been dedicated to developing green products, such as the UV–SIL UV-curable adhesive solutions. Two key products in this series include UV–SIL 8039, which meets GB VOC standards and holds UL GREENGUARD GOLD certification, and UV–SIL X-8039-BO, which contains over 60% bio-based […]
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As 5G smart mobile devices continue to become more compact and lightweight, flexible printed circuit boards (FPCs) are facing dual challenges of higher precision and increased flexibility. The professional team at SIL-MORE recommends the “Low-Temperature Curing Conductive Paste Solution for FPCs.” This solution features products from Nano Top and has been tested to withstand over […]
With the rapid development of high-performance computing (HPC) devices, SIL-MORE’s professional team provides high-performance computing thermal solutions. Our products offer higher thermal conductivity than traditional materials, aligning with the latest manufacturing processes and environmental sustainability. They are the preferred thermal materials for high-performance computing devices. 「Features 」 DOWSIL™ ICL-1XXX Single-Phase Immersion Cooling Fluid Material: Silicone […]
SIL-MORE Group recommends ARALDITE® 2035 A/B, a two-component epoxy adhesive specifically designed for applications exposed to prolonged high-temperature environments. It provides excellent structural support and stability. ARALDITE® 2035 A/B cures at room temperature and can withstand extreme temperatures up to 204°C (400°F), ensuring exceptional bond strength and reliability under harsh conditions. It is ideal for […]
In modern industrial manufacturing, sealants are widely used for bonding and sealing electronic and electrical components. Gasket sealing plays a crucial role in protecting internal electronic components by preventing the ingress of dust, moisture, and corrosive substances, thus avoiding damage to precision components. Gasket sealing technology is an essential part of industrial manufacturing. While traditional […]
Araldite® AV 170 is a single-component epoxy adhesive with excellent heat resistance and chemical resistance, making it a key product for structural bonding applications. It is especially suitable for bonding metals and high-temperature plastics. Product Features Thermal curing performance: Curing temperature range from 140°C to 180°C, achieving high strength quickly. High peel strength: Ideal for […]
SIL-MORE Group is dedicated to providing advanced thermal management solutions tailored to meet the diverse needs of our clients. Our professional team highly recommends the AOS Non-Silicone Thermal Conductive Solution, a product series renowned for its exceptional performance and long-term stability. It is specifically designed for applications where silicone-based thermal pads are unsuitable, and for […]
The “UV-SIL UV Curing Electronic Adhesive Solution” developed by Sil-More Group has obtained UL GREENGUARD GOLD and GB VOC international certifications. This series of products is specifically designed for the electronics manufacturing industry, offering advantages such as rapid curing within 30 seconds and weather resistance reliability between -40°C and 120°C. It effectively reduces the emission […]
Sil-More Group offers “Advanced Composite Plastic Solutions” to meet the growing demand for precision processing in high-tech electronic components. These solutions can be tailored to specific customer requirements by adjusting material properties and incorporating functionalities such as EMI shielding, flame resistance, and weather resistance. This ensures comprehensive compliance with the unique needs of high-tech electronics, […]
With the growing demand for enhanced electronic safety and high-performance structural adhesives, Huntsman introduces Araldite® 2033, a room temperature-curing structural adhesive featuring exceptional flame-retardant properties. Certified to meet UL 94 V-0 flame-retardant standards and EN 45545-2:2013 fire safety requirements, it complies with R22 and R23 criteria for HL3 level—the highest standard set by the European […]